40*40mm copper PCB&PCBA a factory SMD high quality MCPCB 3535 led PCB manufacturer

Product Detail

Product Description

Production capability

Technical parameters and process capability of metal substrate(MCPCB)
ITEM	SPECIFICATION
Surface	LF HASL,immersion gold,immersion silver,OSP
Layer	Single side,double sided Multilayer and special structure
Maximum PCB size	240mmx1490mm OR 490x1190mm
PCB thickness	0.4-3.0mm
Copper Foil thickness	H 1/2/3/4(oz)
Insulation layer thickness	50/75/100/125/150/175/200(um)
Metal Base thickness	Aluminum(1100/3003/5052/6061),Copper Aluminum
Metal Base thickness	0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm)
Shaping	Die punching/CNC Route/V-Cut
Test	100% open&short test
Shaping tolerance	Die Punching<+- 0.05mm,CNC Route<+-0.15mm,V-CUT
Hole tolerance	+-0.5mm
Min.Hole Diameter	Single side 0.5/Double sided PTH0.3MM
Solder mask	green/white/black/red/yellow
Min.letter height	0.8mm
Min.line space	0.15
Min.letter width	0.15
screen color	blue/white/black/red/yellow
Special hole	Spot facing/cup hole/buried via hole/buried tank
File format	Gerber,Pro-tel,Power PCB,Auto CAD etc

Introduction of MCPCB

MCPCB is the abbreviation of Metal core PCBS, including aluminum based PCB,copper based PCB and iron based PCB.

Aluminium based board is the most common type. The base material consists of an aluminum core ,standard FR4 and copper. It features a thermal clad layer that dissipates heat in a highly efficient method while cooling components . Currently, Aluminum Based PCB is regarded as the solution to high power. Aluminium based board can replace frangible ceramic based board, and aluminum provides strength and durability to a product that ceramic bases cannot.

Copper substrate is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum substrates and iron substrates. It is suitable for highest effectively heat dissipation of high frequency circuits, components in regions with great variation in high and low temperature and precision communication equipment.

Thermal insulation layer is one of the core parts of copper substrate, so the thickness of copper foil is mostly 35 m-280 m, which can achieve a strong current- carrying capacity. Compared with aluminum substrate, copper substrate can achieve better heat dissipation effect, so as to ensure the stability of the product.

Structure of Aluminum PCB

Circuit Copper Layer

The circuit copper layer is developed and etched to form a printed circuit, the aluminum substrate can carry a higher current than the same thick FR-4 and same trace width.

Insulating Layer

The insulating layer is the core technology of the aluminum substrate, which mainly plays the functions of insulation and heat conduction. The aluminum substrate insulating layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more effectively it is to spread the heat generated during the device operation, and the lower the temperature of the device, Metal substrate.

What kind of metal will we choose as the insulating metal substrate ?

We need to consider the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

Normally, aluminum is comparatively cheaper than copper . Available aluminum material are 6061, 5052, 1060 and so on. If there are higher requirements for thermal conductivity, mechanical properties, electrical properties and other special properties, copper plates, stainless steel plates, iron plates and silicon steel plates