Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB
Product Details
Base Material:Alu/ copper
Copper Thickness:0.5/1/2/3/4 OZ
Board Thickness:0.6-5mm
Min. Hole Diameter:T/2mm
Min. Line Width:0.15mm
Min. Line Spacing:0.15mm
Surface Finishing:HASL,Immersion gold,Flash gold, plated silver, OSP
Item name:MCPCB LED PCB Printed circuit board,Aluminum PCB,copper core
PCB
V-cut Angle:30°,45°,60°
Shape tolerance:+/-0.1mm
Hole DIA tolerance:+/-0.1mm
Thermal Conductivity:0.8-3 W/M.K
E-test voltage:50-250V
Peel-off strength:2.2N/mm
Warp or twist:</=0.5%
PTH Wall thickness:>0.025mm
| No. | Items | Index |
| 1 | Surface Treatment | HASL,Immersion gold,Flash gold, plated silver, OSP |
| 2 | Layer | Single-side |
| 3 | PCB Thickness | 0.6-5mm |
| 4 | Copper Foil Sickness | 0.5-4Oz |
| 5 | Min hole diameter | T/2mm |
| 6 | Min Line width | 0.15mm |
| 7 | Layers | 1-4 layers |
| 8 | Max board size | 585mm*1185mm |
| 9 | Min board size | 3mm*10mm |
| 10 | Board thickness | 0.4-6.0mm |
| 11 | Min space | 0.127mm |
| 12 | PTH wall thickness | >0.025mm |
| 13 | V-cut | 30/45/60 degree |
| 14 | V-cut size | 5mm*1200mm |
| 15 | Min.bag pad | 0.35mm |
Offer: single sided MCPCB, double sided MCPCB, double layer MCPCB,bendable MCPCB, direct thermal exchange MCPCB, eutectic bonding flip -chip MCPCB. Our MCPCB is customized.
1.aluminum base PCB LED light led light module led
2.aluminum substrate PCB
3.aluminum base copper-clad laminate PCB
4.aluminum base PCB
1)material: FR-4, Copper, Aluminum based
2)layer: 1-4
3)copper thickness: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
4)surface finish: HASL, OSP, Immersion Gold, Immersion silver, Flash gold, Plated silver.
5)solder mask color: Green, black, white.
6)V-cut angle: 30, 45,60 degree
7)E-test voltage: 50-250V
8)Certificate: UL, ISO9001, ROHS ,SGS,CE
MC PCB Technical Capability
| ;Type | Item | Capacity | Type | Item | Capacity |
| Layers | / | 1-4 | Hole size | Drilling hole size | 0.6-6.0mm |
| Laminate | Laminate type | Aluminum, iron, and copper isolation base | Hole tolerance | ±0.05mm | |
| Dimension | 1000*1200mm 60081500mm | Tolerance of hole position | ±0.1mm | ||
| Board thickness | 0.4mm-3.0mm | Aspect ratio | 5:1 | ||
| Tolerance of board thickness | ±0.1mm | Solder mask | Min solder bridge | 4mil | |
| Dielectric thickness | 0.075-0.15mm | Impedance | Impedance tolerance | ±10% | |
| Circuit | Min width/ space | 5mil/ 5mil | Peel strength | ≥1.8 N/mm | |
| Tolerance of width/ space | ±15% | Surface resistance | ≥1*105M | ||
| Copper thickness | Internal and external | 0.5-10 OZ | ≥1*106M | ||
| Volume resistrivity | |||||
| Thermal conductivity | Low heat conductivity 1.0-1.5 | ||||
| Middle heat conductivity 1.5-1.8 | |||||
| High conductivity 2.0-8.0 | |||||
| Solder fioat | 260℃, 10mil, No blister, No determination | ||||
| Permittilvity | ≤4.4 | ||||
