Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB

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Product Detail

Product Details

Base Material:Alu/ copper

Copper Thickness:0.5/1/2/3/4 OZ

Board Thickness:0.6-5mm

Min. Hole Diameter:T/2mm

Min. Line Width:0.15mm

Min. Line Spacing:0.15mm

Surface Finishing:HASL,Immersion gold,Flash gold, plated silver, OSP

Item name:MCPCB LED PCB Printed circuit board,Aluminum PCB,copper core

PCB

V-cut Angle:30°,45°,60°

Shape tolerance:+/-0.1mm

Hole DIA tolerance:+/-0.1mm

Thermal Conductivity:0.8-3 W/M.K

E-test voltage:50-250V

Peel-off strength:2.2N/mm

Warp or twist:</=0.5%

PTH Wall thickness:>0.025mm

No.	Items	Index
1	Surface Treatment	HASL,Immersion gold,Flash gold, plated silver, OSP
2	Layer	Single-side
3	PCB Thickness	0.6-5mm
4	Copper Foil Sickness	0.5-4Oz
5	Min hole diameter	T/2mm
6	Min Line width	0.15mm
7	Layers	1-4 layers
8	Max board size	585mm*1185mm
9	Min board size	3mm*10mm
10	Board thickness	0.4-6.0mm
11	Min space	0.127mm
12	PTH wall thickness	>0.025mm
13	V-cut	30/45/60 degree
14	V-cut size	5mm*1200mm
15	Min.bag pad	0.35mm

Offer: single sided MCPCB, double sided MCPCB, double layer MCPCB,bendable MCPCB, direct thermal exchange MCPCB, eutectic bonding flip -chip MCPCB. Our MCPCB is customized.

1.aluminum base PCB LED light led light module led

2.aluminum substrate PCB

3.aluminum base copper-clad laminate PCB

4.aluminum base PCB

1)material: FR-4, Copper, Aluminum based

2)layer: 1-4

3)copper thickness: 0.5oz, 1.0oz, 2oz, 3oz, 4oz

4)surface finish: HASL, OSP, Immersion Gold, Immersion silver, Flash gold, Plated silver.

5)solder mask color: Green, black, white.

6)V-cut angle: 30, 45,60 degree

7)E-test voltage: 50-250V

8)Certificate: UL, ISO9001, ROHS ,SGS,CE

MC PCB Technical Capability

;Type	Item	Capacity	Type	Item	Capacity
Layers	/	1-4	Hole size	Drilling hole size	0.6-6.0mm
Laminate	Laminate type	Aluminum, iron, and copper isolation base		Hole tolerance	±0.05mm
	Dimension	1000*1200mm 60081500mm		Tolerance of hole position	±0.1mm
	Board thickness	0.4mm-3.0mm		Aspect ratio	5:1
	Tolerance of board thickness	±0.1mm	Solder mask	Min solder bridge	4mil
	Dielectric thickness	0.075-0.15mm	Impedance	Impedance tolerance	±10%
Circuit	Min width/ space	5mil/ 5mil	Peel strength	≥1.8 N/mm
	Tolerance of width/ space	±15%	Surface resistance	≥1*105M
Copper thickness	Internal and external	0.5-10 OZ		≥1*106M
			Volume resistrivity
Thermal conductivity		Low heat conductivity 1.0-1.5
		Middle heat conductivity 1.5-1.8
		High conductivity 2.0-8.0
Solder fioat		260℃, 10mil, No blister, No determination
Permittilvity		≤4.4