EMC Design Spark FR4 PCB And The Printed Circuit Board
Product Details
Base Material:FR4
Copper Thickness:1oz
Board Thickness:1.6mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm
Min. Line Spacing:0.1mm
Surface Finishing:HASL
Solder Mask:Green
Silkscreen:White
PCB Test:Test-rig,Flying Probe Test
PCBA Test:X-ray,AOI Test,Functional test
Certificate:UL. ROHS. CE
Type of services:High Quality PCB Manufacturing
Keywords:blank PCB board price
Service:One-stop Service
Layer:1-24layers
Item |
Specification |
|
1 |
Number of Layer |
1-18Layers |
2 |
Material |
FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
3 |
Surface Finish |
HASL(LF), Gold plating, Electrolysis nickel immersion gold, Immersion Tin, OSP |
4 |
Finish Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
5 |
Copper Thickness |
1/2 oz min;12 oz max |
6 |
Solder Mask |
Green/Black/White/Red/Blue/Yellow |
7 |
Min.Trace Width & Line Spacing |
0.075mm/0.1mm(3mil/4mil) |
8 |
Min.Hole Diameter for CNC Drilling |
0.1mm(4mil) |
9 |
Min.Hole Diameter for punching |
0.9mm(35mil) |
10 |
Biggest panel size |
610mm*508mm |
11 |
Hole Position |
+/-0.075mm(3mil) CNC Drilling |
12 |
Conductor Width(W) |
0.05mm(2mil)or; +/-20% of original artwork |
13 |
Hole Diameter(H) |
PTH L:+/-0.075mm(3mil); NON-PTH L:+/-0.05mm(2mil) |
14 |
Outline Tolerance |
0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
15 |
Warp & Twist |
0.70% |
16 |
Insulation Resistance |
10Kohm-20Mohm |
17 |
Conductivity |
<50ohm |
18 |
Test Voltage |
10-300V |
19 |
Panel Size |
110×100mm(min);660×600mm(max) |
20 |
Layer-layer ministration |
4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
21 |
Min.spacing between hole edge to circuity pattern of an inner layer |
0.25mm(10mil) |
22 |
Min.spacing between board outline circuitry pattern of an inner layer |
0.25mm(10mil) |
23 |
Board thickness tolerance |
4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
24 |
Impedance Control |
+/-10% |
25 |
Different Impedance |
+-/10% |