T8 T5 LED light aluminum LED PCB board high lumen PCB/linear light strip/linear LED strip MCPCB


Product Detail

LED PCB/PCBA

Product T8/T5/LED batten/linear light
Substrates Material Aluminum
Copper Thickness 1.0-2.0mm
Copper Thickness 0.5-6oz
Thermal Conductivity 1.0-3.0W/m.k
Breakdown Voltage 2-4KV
LED SMD2835
Combustibility 94V0
Solder mask White
Silk screen Black
Working temp -25-75℃
Service OEM&ODM
Surface treatment HAL/OSP/Immersion Gold Plating/Gold Plating/Sn Plating/Immersion Sn
Standard Standard

Other led

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FR-4 PCB Technical Capability

Item Normal capacity Limit capacity Item Normal capacity Limit capacity
Layer No. 2-16 ≤20 Max. copper thickness( Inner layer) 4OZ 5OZ
Core board thickness 0.075-2.0mm 0.05-3.0mm Max. copper thickness( Outer layer) 4OZ 6OZ
min. PTH to copper 165.1um 152.4um Min. space between SMD pads for S/M bridge 203.2um 177.8um
Board thickness(double sides) 0.3-3.2mm 0.3-4mm Minimum legend width/height 127um /762um 101.6um /609.6um
Board thickness(Multi-layer) 0.6-3.2mm 0.6-4mm Outline dimension tolerance ±101.6um  ±76.2um 
Tolerance of board thickness(T≤0.8mm) 0.1mm 0.075mm Bow & twist (T≤1mm) ≤0.75% ≤0.5%
Tolerance of board thickness(T>0.8mm) ±10% ±5% Bow & twist (T≤1mm) ≤0.5% ≤0.3%
Min. line width 76.2um 63.5um  Precision of hole to hole ±0.05mm /
Minimum line space 68.58um 63.5um Impedance control range ±10% ±8%
Minimum hole diameter 0.2mm 0.15mm Aspect ratio (0.2mm) 10:1 12:1
Tolerance of press fit hole diameter 0.05mm 0.05mm Finished product size 55-600mm 10-620mm
profiling method CNC、  V-CUT、 Punching or mold
Surface treatment EING、 OSP、 Immersion silver、 Selective OSP+ENIG
Laminate type FR-4.0, FR-4.1(Normal TG, middle TG, high TG), CEM-3,
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