Factory Free sample Pcb Case Design - EMC Design Spark FR4 PCB And The Printed Circuit Board – Welldone

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We have been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for Using Prototype Pcb, Flexible Pcb, Pcb Thickness, To achieve reciprocal advantages, our company is widely boosting our tactics of globalization in terms of communication with overseas customers, fast delivery, the best quality and long-term cooperation.

Factory Free sample Pcb Case Design - EMC Design Spark FR4 PCB And The Printed Circuit Board – Welldone Detail:

Product Details

Base Material:FR4

Copper Thickness:1oz

Board Thickness:1.6mm

Min. Hole Size:0.2mm

Min. Line Width:0.1mm

Min. Line Spacing:0.1mm

Surface Finishing:HASL

Solder Mask:Green

Silkscreen:White

PCB Test:Test-rig,Flying Probe Test

PCBA Test:X-ray,AOI Test,Functional test

Certificate:UL. ROHS. CE

Type of services:High Quality PCB Manufacturing

Keywords:blank PCB board price

Service:One-stop Service

Layer:1-24layers

Item	Specification
1	Number of Layer	1-18Layers
2	Material	FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3	Surface Finish	HASL(LF), Gold plating, Electrolysis nickel immersion gold, Immersion Tin, OSP
4	Finish Board Thickness	0.2mm-6.00 mm(8mil-126mil)
5	Copper Thickness	1/2 oz min;12 oz max
6	Solder Mask	Green/Black/White/Red/Blue/Yellow
7	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
8	Min.Hole Diameter for CNC Drilling	0.1mm(4mil)
9	Min.Hole Diameter for punching	0.9mm(35mil)
10	Biggest panel size	610mm*508mm
11	Hole Position	+/-0.075mm(3mil) CNC Drilling
12	Conductor Width(W)	0.05mm(2mil)or; +/-20% of original artwork
13	Hole Diameter(H)	PTH L:+/-0.075mm(3mil); NON-PTH L:+/-0.05mm(2mil)
14	Outline Tolerance	0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching
15	Warp & Twist	0.70%
16	Insulation Resistance	10Kohm-20Mohm
17	Conductivity	<50ohm
18	Test Voltage	10-300V
19	Panel Size	110×100mm(min);660×600mm(max)
20	Layer-layer ministration	4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max
21	Min.spacing between hole edge to circuity pattern of an inner layer	0.25mm(10mil)
22	Min.spacing between board outline circuitry pattern of an inner layer	0.25mm(10mil)
23	Board thickness tolerance	4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil)
24	Impedance Control	+/-10%
25	Different Impedance	+-/10%

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