Professional Design Automated Pcb Assembly - PTR/IR Sensor Printed Circuit Board PCB For Control LED Light – Welldone

Product Details

Base Material:MCPCB

Copper Thickness:0.5-3OZ

Board Thickness:0.2-3.0mm

Min. Hole Size:0.25mm/10mil

Min. Line Width:0.1mm/4mil

Min. Line Spacing:0.1mm/4mil

voltage:12V 24V

Surface Finishing:Antioxidant, lead-free/lead-sprayed tin, chemistry

wattage:36W

sensor type:PIR motion sensor

size:17mm * 10mm

material:PCB

Application:Motion Sensor

Project Case

Introduction of MCPCB

MCPCB is  the abbreviation of  Metal core PCBS, including aluminum based PCB,copper based PCB and iron based PCB.

Aluminium based board  is the most common type. The base material consists of an aluminum core ,standard FR4 and copper. It features a thermal clad layer that dissipates heat in a highly efficient method while cooling components . Currently, Aluminum Based PCB is regarded as the solution to high power.  Aluminium based board can replace frangible ceramic based board, and aluminum provides strength and durability to a product that ceramic bases cannot.

Copper substrate is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum substrates and iron substrates. It is suitable for highest effectively heat dissipation of high frequency circuits, components in regions with great variation in high and low temperature and precision communication equipment.

Thermal insulation layer is one of the core parts of copper substrate, so the thickness of copper foil is mostly 35 m-280 m, which can achieve a strong current-carrying capacity. Compared with aluminum substrate,  copper substrate can achieve better heat dissipation effect, so as to ensure the stability of the product.

Structure of Aluminum PCB

Circuit Copper Layer

The circuit copper layer is developed and etched to form a printed circuit,  the aluminum substrate can carry a higher current than the same thick FR-4 and same trace width.

Insulating Layer

The insulating layer is the core technology of the aluminum substrate, which mainly plays the functions of  insulation and heat conduction. The aluminum substrate insulating layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more effectively it is to spread the heat generated during the device operation, and the lower the temperature of the device,

Metal substrate

What kind of metal will we choose as the insulating metal substrate ?

We need to consider the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

Normally, aluminum  is comparatively cheaper than copper . Available aluminum material are 6061, 5052, 1060 and so on. If there are higher requirements for thermal conductivity, mechanical properties, electrical properties and other special properties, copper plates, stainless steel plates, iron plates and silicon steel plates can also be used.