Sink PAD

  • Thermal management Printed Circuit Board (PCB)-SinkPAD TM

    Thermal management Printed Circuit Board (PCB)-SinkPAD TM

    SinkPAD is a thermal management Printed Circuit Board (PCB) technology that makes it possible to conduct heat out of a LED and into the atmosphere faster and more efficiently than a conventional MCPCB. SinkPAD provides superior thermal performance for medium to high power LEDs.

  • Low-cost Aluminum core laminated copper foil SinkPAD PCB

    Low-cost Aluminum core laminated copper foil SinkPAD PCB

    What is the Thermoelectric Separation Substrate?
    The circuit layers and the thermal pad on the substrate are separated, and the thermal base of thermal components directly contact the heat-conducting medium to achieve the optimal thermal conductive (zero thermal resistance) effect. The material of the substrate is generally a metal (Copper) substrate.
  • Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Product Details Base Material:Alu/ copper Copper Thickness:0.5/1/2/3/4 OZ Board Thickness:0.6-5mm Min. Hole Diameter:T/2mm Min. Line Width:0.15mm Min. Line Spacing:0.15mm Surface Finishing:HASL,Immersion gold,Flash gold, plated silver, OSP Item name:MCPCB LED PCB Printed circuit board,Aluminum PCB,copper core PCB V-cut Angle:30°,45°,60° Shape tolerance:+/-0.1mm Hole DIA tolerance:+/-0.1mm Thermal Conductivity:0.8-3 W/M.K E-test voltage:50-250V Peel-off strength:2.2N/mm Warp or twist:</=0.5...