Thermal management Printed Circuit Board (PCB)-SinkPAD TM

SinkPAD is a thermal management Printed Circuit Board (PCB) technology that makes it possible to conduct heat out of a LED and into the atmosphere faster and more efficiently than a conventional MCPCB. SinkPAD provides superior thermal performance for medium to high power LEDs.

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Product Detail

Layer: 1 Layers

Material: Aluminum base

Thermal conductivity: 210.0w/m.k

Board thickness: 2.0mm

Copper thickness: 2.o oz

Surface treatment: LF HASL

Solder mask: Black

Silk screen: White

Origin: China

Thermoelectric separation: SinkPAD Technology

Application: Medical products

SinkPAD-II

SinkPAD^TM technology has magnitudes higher thermal efficiency than even the very best MCPCB in the market. SinkPAD^TM MCPCB is available with Aluminum base metal or Copper base metal. Aluminum based SinkPAD^TM PCB can transfer heat at the rate of 210.0 W/m.K and Copper based SinkPAD^TM PCB can transfer heat at a rate of 385.0 W/m.K while conventional MCPCBs have a heat transfer rate of 1-5 W/m.K. The way in which we can accomplish this dramatic improvement is by creating a Direct Thermal Path from the LED to the base metal.

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Aluminum Base Pcb