Hot Sales HDI Multilayer FR4 PCB Circuit Boards For Micro SD Card
Quick Details:
Copper Thickness:1 oz
Board Thickness:1.0mm
Min. Hole Size:0.20mm
Min. Line Width:0.075mm
Min. Line Spacing:0.075mm
Surface Finishing:ENIG
Board Size:Customized
Solder mask Color:Green Ink
Board Thickness Tolerance:+/-10%
V-cut angle:25°,30°,45°,60°
Twist&Wrap:≤ 0.5%
File:Pro tel 99se/P-CAD/Auto cad/Cam350
Inner packing:Vacuum packing,Plastic bag
Outer packing:Standard carton packing
Service:PCB & PCBA
Layer:6 layer
Silk mask:White
Products Description
| 1 | Description | PCB Specification |
| 2 | Material | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum |
| 3 | Layer | 1-20 |
| 4 | Board Thickness | 0.2mm- 4.0mm |
| 5 | Board Thickness Tolerance | +/-10% |
| 6 | Copper thickness | 17.5um-175um (0.5oz-5oz) |
| 7 | Min Trace Width | 0.15mm |
| 8 | Min Space Width | 0.15mm |
| 9 | Min Drilling Dia | 0.2mm |
| 10 | PTH copper thickness | 0.4-2mil(10-50um) |
| 11 | Tolerance of Etching | ±1mil(±25um) |
| 12 | V-cut angle | 25°,30°,45°,60° |
| 13 | Pearl Strength of line | ≥ 6lb/in(≥ 107g/mm) |
| 14 | Impedance control and tolerance | 50Ω±10% |
| 15 | Twist&Wrap | ≤ 0.5% |
| 16 | Solder mask | Green, Red, Blue, White, Black, Yellow |
| 17 | Surface Finish/Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
| 18 | Certificate | ROSH. ISO9001 |
| 19 | File | Protel 99se/P-CAD/Auto cad/Cam350 |
| 20 | Inner packing | Vacuum packing,Plastic bag |
| 21 | Outer packing | Standard carton packing |
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