Product Details
Board Thickness:1.0mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm
Min. Line Spacing:0.1mm
Surface Finishing:lead less, HASL – LF,ENIG,ENEPIG,OSP,Gold Finger
Board Size:1200mm x 600mm
Certificate:ISO 9001
Solder Mask Colour:Green ,White ,Black ,Red, Blue, Yellow
Special Technology:Blind&buried via, Via In Pad, Back drill
Special Hole:Blind&buried hole,Depth milling,T-slot
Shaping:CNC Routing,Punching,V-CUT, Depth milling